半導體製程技術
Semiconductor Process and Technology
| 節 | 週一 |
|---|---|
A 18:30–19:20 | 半導體製程技術 SA321(光復) 3 節連堂 |
B 19:30–20:20 | |
C 20:30–21:20 |
* 根據陽明交大上課時間表所列
學習半導體CMOS製程
基本物理與化學
無備註
powerpoint
期中考40% 期末考60%
Chap.1 Introduction to the Semiconductor Industry Chap.2 characteristics of Semiconductor Materials Chap.3 Device Technology Chap.4 Silicon and Wafer Preparation Chap.5 Chemical on Semiconductor Fabrication Chap.6 contamination Control in Wafer Fabs Chap.7 Metrology and Defect Inspection Chap.8 Gas Control on Process Chambers Chap.9 IC Fabrication Process Overview Chap.10 Oxidation Chap.11 Deposition Chap.12 Metallization Chap.13 Photolithography: Vapor prime to soft bake Chap.14 Photolithography: Alignment and exposure Chap.15 Photolithography: Photoresist development and advanced lithography Chap.16 Etch Chap.17 Ion Implant Chap.18 Chemical Mechanical Planarization
教師未提供此項資料
Semiconductor Manufacturing Technology, by M. Quirk and J. Serda, Prentice Hall, 2001
- 地點
- SC-306
- 時間
- 2CD, 5G
- 聯絡方式
- 03-5131367
