先進電子工程材料
Advanced Electronic Materials Science & Engineering
| 節 | 週二 | 週四 |
|---|---|---|
4 11:10–12:00 | 先進電子工程材料 EE205（光復） | 先進電子工程材料 EE205（光復） 2 節連堂 |
N 12:20–13:10 |
* 根據陽明交大上課時間表所列
課程概述與目標: This course examines topics associated with the science, engineering and applications of various types of materials that exhibit specific electrical and/or electronic properties. Materials include metals, alloys, electrical ceramics, polymers and semiconductors. The relationships between the materials structures (atomic and microstructure) and the properties as well as the underlying physical or chemical principles are taught to enable students to better understand why certain materials are chosen for certain functions in a variety of applications.
Junior standing or postgraduate students
無備註
This course is primarily delivered by in-person lectures with supplementary video films or other demonstrations as needed.
Attendance and home work assignments (20%) Midterm Exam (40%) Final Exam (40%)
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| 週次 | 主題 |
|---|---|
| 第 1 週 | Atomic Structure, Chemical Bonds, Electronic Band Structure, Crystalline Defects 2/23 & 2/25 |
| 第 2 週 | Diffusion Mechanisms and Kinetics 3/2 & 3/4 |
| 第 3 週 | Homo-epitaxy, Hetero-epitaxy and Surface Kinetics 3/9 & 3/11 |
| 第 4 週 | Introduction to Electrical and Functional Ceramics 3/16 & 3/18 |
| 第 5 週 | The Fabrication of Ceramics 3/23 & 3/25 |
| 第 6 週 | Dielectrics, Ferroelectrics and Insulators 3/30 & 4/1 |
| 第 7 週 | Piezoelectric Ceramics 4/6 & 4/8 |
| 第 8 週 | Review and Midterm Exam 4/13 & 4/15 |
| 第 9 週 | Principles, Processing and Applications of Compound Semi-conductors (Part I) 4/20 & 4/22 |
| 第 10 週 | Principles, Processing and Applications of Compound Semi-conductors (Part II) 4/27 & 4/29 |
| 第 11 週 | Pyroelectric Materials and Electro-optic Ceramics 5/4 & 5/6 |
| 第 12 週 | Ceramics Ceramic Conductors, Magnetic and Oxide Superconductor 5/11 & 5/13 |
| 第 13 週 | Classification and Assembly Process for Electronic Packaging 5/18 & 5/20 |
| 第 14 週 | Materials, Processes and Thermal Management of Packaging 5/25 & 5/27 |
| 第 15 週 | Thick Film Technologies and Components 6/1 & 6/3 |
| 第 16 週 | Review and Final Exam 6/8 & 6/10 |
| 第 17 週 | Special Topics 6/15 & 6/17 |
| 第 18 週 | Comprehensive Review of the Course 6/22 & 6/24 |
Class notes are provided. Reference books or articles are cited.
- 地點
- To be determined
- 時間
- To be determined
- 聯絡方式
- email or via the NCTU e3 online platform