封裝技術與設備
Packaging Technology and Equipment
| 節 | 週一 |
|---|---|
A 18:30–19:20 | 封裝技術與設備 3 節連堂 |
B 19:30–20:20 | |
C 20:30–21:20 |
* 根據陽明交大上課時間表所列
This course focuses on the fundamentals of microsystems packaging. The microsystems include microelectronics, photonics, RF, and MEMS.
NO
無備註
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(a) 40% for 8 homework and assignments, (b) 30% for mid-term exam, and (c) 30% for final exam
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| 週次 | 主題 |
|---|---|
| 第 1 週 | INTRODUCTION TO MICROSYSTEMS PACKAGING 2/22 |
| 第 2 週 | THE ROLE OF PACKAGING IN MICROELECTRONICS 3/1 |
| 第 3 週 | THE ROLE OF PACKAGING IN MICROSYSTEMS 3/8 |
| 第 4 週 | FUNDAMENTALS OF ELECTRICAL PACKAGE DESIGN 3/15 |
| 第 5 週 | FUNDAMENTALS OF DESIGN FOR REUABILITY 3/22 |
| 第 6 週 | FUNDAMENTALS OF THERMAL MANAGEMENT 3/29 |
| 第 7 週 | FUNDAMENTALS OF SINGLE CHIP PACKAGING 4/5 |
| 第 8 週 | Mid-term exam 4/12 |
| 第 9 週 | FUNDAMENTALS OF MULTICHIP PACKAGING 4/19 |
| 第 10 週 | FUNDAMENTALS OF IC ASSEMBLY 4/26 |
| 第 11 週 | FUNDAMENTALS OF WAFER-LEVEL PACKAGING 5/3 |
| 第 12 週 | FUNDAMENTALS OF PASSIVES: DISCRETE, INTEGRATED, AND EMBEDDED 5/10 |
| 第 13 週 | FUNDAMENTALS OF OPTOELECTRONICS 5/17 |
| 第 14 週 | FUNDAMENTALS OF RF PACKAGING 5/24 |
| 第 15 週 | FUNDAMENTALS OF MICROELECTROMECHANICAL SYSTEMS 5/31 |
| 第 16 週 | Final exam 6/7 |
| 第 17 週 | Make-up week 6/14 |
| 第 18 週 | Make-up week 6/21 |
FUNDAMENTALS OF MICROSYSTEMS PACKAGING By Rao R. Tummala McGRAW-HILL
- 地點
- 教師未提供此項資料
- 時間
- Monday 17:00-18:00
- 聯絡方式
- wuchingchou@mail.nctu.edu.tw