電子構裝技術
Electronic Packaging Technology For Electronics
| 節 | 週一 | 週二 |
|---|---|---|
3 10:10–11:00 | 電子構裝技術 2 節連堂 | |
4 11:10–12:00 | 電子構裝技術 |
* 根據陽明交大上課時間表所列
This course will teach the fundamentals for packaging, including bonding, metallurgical reactions, and reliabilities. It will also cover science and technology of microelectronic packaging. Die Attach/Chip Bond, Wire Bond, Flip Chip Technology, Ball Grid Array Technology, Pb-based and Pb-free Solders, Ceramic Packaging, Plastic Packaging, Printed Circuit Boards, Chip Scale Packaging, Direct Chip Attach, system in packaging, state-of-the-art 3D IC packaging, Cu-Cu bonding. Metallurgical reactions between Cu-Sn, Ni-Sn, and Sn-Au. Sn whisker, Stress in thin films, Mean-time-to-failure measurement, Phase transformation and phase diagrams of solders.
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無備註
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1學期作業 None 2.評量方法 Two midterms : 40%, Final :20%; Term paper-paper critique : 20% Presentation : 20%
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| 週次 | 主題 |
|---|---|
| 第 1 週 | Introduction Die Bonding, Leadframe Chip-level connection-- Wire bonding 2023-02-13(一),2023-02-14(二) |
| 第 2 週 | Chip-level connections —TAB Chip-on-film Chip-level connection--Flip Chip Technology I-Introduction Reliability Pb-based and Pb-free solders, 2023-02-20(一),2023-02-21(二) |
| 第 3 週 | FCT Reliability :Metallurgical Reaction (I) 2023-02-27(一),2023-02-28(二) |
| 第 4 週 | FCT Reliability :FCT Reliability :Metallurgical Reaction (II) 2023-03-06(一),2023-03-07(二) |
| 第 5 週 | FCT Reliability: Metallurgical Reaction (III) Solder bump fabrication. 2023-03-13(一),2023-03-14(二) |
| 第 6 週 | Midterm 2023-03-20(一),2023-03-21(二) |
| 第 7 週 | FCT Reliability : Electromigration I, 2023-03-27(一),2023-03-28(二) |
| 第 8 週 | Holidays 2023-04-03(一),2023-04-04(二) |
| 第 9 週 | FCT Reliability: Electromigration II Thermo-migration 2023-04-10(一),2023-04-11(二) |
| 第 10 週 | Sn Whisker Ceramic Packaging, Plastic Packaging, Printed Circuit Boards/PTH, SMT CPU packaging, Chip Scale Packaging, 2023-04-17(一),2023-04-18(二) |
| 第 11 週 | Midterm/ Company Visiting- Chip Bond Technology-tentative 2023-04-24(一),2023-04-25(二) |
| 第 12 週 | Fan-out packaging 2023-05-01(一),2023-05-02(二) |
| 第 13 週 | 3D IC Packaging Effect of solder volume on the reliabilities of solder joints/microbumps. 2023-05-08(一),2023-05-09(二) |
| 第 14 週 | 3D IC Packaging Cu direct bonding. 2023-05-15(一),2023-05-16(二) |
| 第 15 週 | Group Presentation 2023-05-22(一),2023-05-23(二) |
| 第 16 週 | Final Exam 2023-05-29(一),2023-05-30(二) |
| 第 17 週 | 2023-06-05(一),2023-06-06(二) |
| 第 18 週 | 2023-06-12(一),2023-06-13(二) |
Textbook: K. N. Tu, Hung-Ming Chen, Chih Chen. Electronic Packaging Science and Engineering, Wiley 2021. Reference books: 1. K. N. Tu, Solder Joint Technology: Materials, Properties, and Reliability (Springer 2007) 2. 3D Microelectronic packaging: from fundamentals to applications, Editors: Li, Yan, Goyal, Deepak (Eds.), Springer. 2. “Electronic Packaging, Design, Materials, Process, and Reliability”John Lau, C.P. Wong, John L. Prince, and Wataru Nakayama, McGraw-Hill. 3. “Principles of Electronic Packaging ”Donald P. Seraphim, Ronald C. Lasky, Che-yu Li, McGraw-Hill, 1993. 4. “Flip chip technologies” John H. Lau, McGraw-Hill, 1996. 5. “Fundamentals of Microsystems Packaging”, R.R. Tummala, McGraw-Hill, 2001 6微電子材料與製程,陳力俊主編中國材料科學學會 2000 7. Microelectronics packaging handbook” R.R. Tummala and E.J. Rymaszewski, Van Nostrand Reinhold, 1989. 8. Electronic Thin Film Science: For Electrical Engineers and Materials Scientists Tu, King-Ning/ Mayer, James W./ Feldman, Leonard C. 9. Fan-Out Wafer-Level Packaging, John H Lau, Springer, 2018.
- 地點
- EF310
- 時間
- TBA
- 聯絡方式
- 31814