封裝技術與設備

Packaging Technology and Equipment

學期

112-2

學分

0 學分

當期課號

535951

永久課號

STVS30012

開課單位

國際半導體越南境外專班

授課教師

陳俊豪

類別

必修

上課時間表

節	週一
A 18:30–19:20	封裝技術與設備 3 節連堂
B 19:30–20:20
C 20:30–21:20

* 根據陽明交大上課時間表所列

概述

This course introduces the fundamental concepts of the Packaging Technology and Equipment, as well as the process technology and corresponding failure analysis on the electronic packages.

先修科目

Master students

備註

無備註

教學方式

教師未提供此項資料

評分方式

(1) 考試方式How tests are conducted..homework, assignments, mid-term exam, and final exam. (2) 考評項目其所佔總分比率Evaluation items, with their percentage of the total score.. Attendance: 10% Midterm Presentation: 30% Final exam (or report): 30% Final Report: 30%

課程大綱

教師未提供此項資料

週次計畫

週次	主題
第 1 週	Introduction to Electronic Packaging I
第 2 週	Introduction to Electronic Packaging II
第 3 週	Assembly and Process Technology in Electronic Packaging I
第 4 週	Assembly and Process Technology in Electronic Packaging II
第 5 週	Fundamentals of Single Chip Packaging
第 6 週	Fundamentals of Multi-chip Packaging
第 7 週	Fundamentals of First Level Packaging
第 8 週	Materials in First Level Packaging – TAB, Soldering & Sintering
第 9 週	Materials in First Level Packaging – Wire bonding & Si interposer
第 10 週	Mid-term: online presentation
第 11 週	Fundamentals of Wafer-Level Packaging
第 12 週	From Wafer-Level Packaging to Panel Level Packaging
第 13 週	Fundamentals of Thermal Management
第 14 週	Fundamentals of Reliability and Analysis I
第 15 週	Fundamentals of Reliability and Analysis II
第 16 週	Final Exam

教科書

(1) Materials for Advanced Packaging 2nd Edition, Daniel¬ Lu¬ & C.P.¬Wong, Springer, 2009. (2) Wire bonding in microelectronics 3rd edition, George Harman, McGraw-Hill, 2009. (3) K. N. Tu, Hung-Ming Chen, Chih Chen. Electronic Packaging Science and Engineering, Wiley 2021. (4) FUNDAMENTALS OF MICROSYSTEMS PACKAGING, By Rao R. Tummala, McGRAW-HILL

Office Hours

地點: 教師未提供此項資料
時間: Monday 17:00-18:00
聯絡方式: chench@nycu.edu.tw