前瞻CMOS製程整合工程
Advanced CMOS Process Integration Engineering
| 節 | 週五 |
|---|---|
5 13:20–14:10 | 前瞻CMOS製程整合工程 ED302（光復） 3 節連堂 |
6 14:20–15:10 | |
7 15:30–16:20 |
* 根據陽明交大上課時間表所列
A qualified process integration engineer requires to possess interdisciplinary knowledge across advanced CMOS device physics, semiconductor fabrication process, and basic CMOS device/standard cell/SRAM designs. Yield enhancement and reliability qualification are also important functional areas. The goal of this course is to provide the comprehensive and practical approaches to introduce the aforementioned subjects with sufficient depth for students interested in the process integration engineering (PIE) by lecturers from industry.
Semiconductor Device and Physics (Required); Basic knowledge in CMOS circuits (Preferred)
無備註
上課為保障智慧財產權,不得照相、錄音或錄影。
Mid-Term Exam 50% Final Exam 50%
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| 週次 | 主題 |
|---|---|
| 第 1 週 | Introduction 2024-02-23(五) |
| 第 2 週 | Technology Definition, Evolution of CMOS device, and Process Modules Overview 2024-03-01(五) |
| 第 3 週 | Basic Process Introduction (TSMC 林義雄老師) 2024-03-08(五) |
| 第 4 週 | GateStandard cells and SRAM Cells 2024-03-15(五) |
| 第 5 週 | Fabrication processes of advanced CMOS 2024-03-22(五) |
| 第 6 週 | Device Engineering 2024-03-29(五) |
| 第 7 週 | Holiday Week (On-line: Fabrication processes of advanced CMOS) 2024-04-05(五) |
| 第 8 週 | Device Engineering 2024-04-12(五) |
| 第 9 週 | Mid Term Exam 2024-04-19(五) |
| 第 10 週 | Device Engineering 2024-04-26(五) |
| 第 11 週 | Device Engineering 2024-05-03(五) |
| 第 12 週 | Lithography/Patterning Technology 2024-05-10(五) |
| 第 13 週 | Lithography/Patterning Technology 2024-05-17(五) |
| 第 14 週 | Process defects & yield enhancement 2024-05-24(五) |
| 第 15 週 | Product Development Cycle 2024-05-31(五) |
| 第 16 週 | Final Exam 2024-06-07(五) |
課程講義
- 地點
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- 時間
- By appointment
- 聯絡方式
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