電子封裝材料破壞學與失效概論
Introduction to Fractography and Failure Analysis in Electronic Packaging
| 節 | 週四 |
|---|---|
2 09:00–09:50 | 電子封裝材料破壞學與失效概論 EE116（光復） 3 節連堂 |
3 10:10–11:00 | |
4 11:10–12:00 |
* 根據陽明交大上課時間表所列
The rapid evolution of electronics over the last decades has caused a higher level of reliability concerns because of the miniaturization, elevated power level and the harsh environment involved in these IC packages. In this context, failure analysis serves a key role in improving the design of the IC from the beginning and guiding the correct direction for better reliability and sustainability of these electronic devices. This course introduces fundamental concepts of failure analysis and analysis methods, particularly for electronic packaging and materials.
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1.Homework and Assignments, Exams and Quizzes, Evaluation and Grading Policy: None 2. Pedagogy and other supplementary information (websites, TAs, handouts and/or databases) : Attendance 10%, Midterm 30%, Final exam 30%, Final Report 30%.
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| 週次 | 主題 |
|---|---|
| 第 1 週 | Introduction and Overview of Failure Analysis I – general concepts 2025-02-20(四) |
| 第 2 週 | Introduction and Overview of Failure Analysis II - electronics 2025-02-27(四) |
| 第 3 週 | Observation of Fractography I - Macroscopic 2025-03-06(四) |
| 第 4 週 | Observation of Fractography II - Microscopic 2025-03-13(四) |
| 第 5 週 | Failure and Fracture Composition Analysis I – Surface analysis 2025-03-20(四) |
| 第 6 週 | Failure and Fracture Composition Analysis II – Sub-surface and bulk analysis 2025-03-27(四) |
| 第 7 週 | Nondestructive and destructive analysis 2025-04-03(四) |
| 第 8 週 | Midterm 2025-04-10(四) |
| 第 9 週 | Static failure modes and mechanisms I – ductile, brittle, and quasi-fracture 2025-04-17(四) |
| 第 10 週 | Static failure modes and mechanisms II – macro- and microscopic fractography 2025-04-24(四) |
| 第 11 週 | Fracture statistics 2025-05-01(四) |
| 第 12 週 | Fatigue and creep failure 2025-05-08(四) |
| 第 13 週 | Fracture Mechanics 2025-05-15(四) |
| 第 14 週 | Corrosion failure 2025-05-22(四) |
| 第 15 週 | High temperature failure 2025-05-29(四) |
| 第 16 週 | Final Exam 2025-06-05(四) |
Textbook: Reference books: 1. Sullivan, Daniel J. D. and Carleton, Eric J.. Failure Analysis: High Technology Devices, Berlin, Boston: De Gruyter, 2022. https://doi.org/10.1515/9781501524790 2. 材料破損分析Failure Analysis,莊東漢, 五南圖書出版股份有限公司2007 3. Brooks, Charlie R., and Ashok Choudhury. 2002. Failure Analysis of Engineering Materials. 1st ed. New York: McGraw-Hill Education.
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