半導體材料與元件特性分析
Semiconductor Material and Device Characterization
| 節 | 週四 |
|---|---|
2 09:00–09:50 | 半導體材料與元件特性分析 EE210（光復） 3 節連堂 |
3 10:10–11:00 | |
4 11:10–12:00 |
* 根據陽明交大上課時間表所列
This course covers the fundamental semiconductor material and device characteristics as well as the commonly used characterization techniques in semiconductor research and industry. Electrical characterization is the main focus since the performance of devices can be directly measured or interpreted. Material characterization techniques, including electron beam, X-ray, ion beam, and optical methods, that are usually employed for in-line monitor, process development or failure analysis are also emphasized. The object of the course is to prepare students with the knowledge linking semiconductor materials and device characteristics with measurement techniques for them to pursue advanced graduated research or careers in industry.
Semiconductor Physics and Devices Preferred
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Homework 30% Mid-term 35% Final Exam 35%
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| 週次 | 主題 |
|---|---|
| 第 1 週 | Introduction 2025-09-04(四) |
| 第 2 週 | Basics of Semiconductor Physics 2025-09-11(四) |
| 第 3 週 | Review of Semiconductor Devices 2025-09-18(四) |
| 第 4 週 | 1. Resistance and Capacitance Measurements2. Doping and Mobility of Semiconductor Materials 2025-09-25(四) |
| 第 5 週 | Junctions (PN, Metal-semiconductor) 2025-10-02(四) |
| 第 6 週 | MOSCAP, Gate Dielectrics, and Interface 2025-10-09(四) |
| 第 7 週 | Characterization of Electronic Defects 2025-10-16(四) |
| 第 8 週 | Mid-Term Exam 2025-10-23(四) |
| 第 9 週 | Characterization of Transistor-I 2025-10-30(四) |
| 第 10 週 | Characterization of Transistor-II 2025-11-06(四) |
| 第 11 週 | Electron Beam Techniques-I 2025-11-13(四) |
| 第 12 週 | Electron Beam Techniques-II 2025-11-20(四) |
| 第 13 週 | X-ray Analysis + 2025-11-27(四) |
| 第 14 週 | Ion Beam Methods 2025-12-04(四) |
| 第 15 週 | Optical Methods, Surface Profile and Contamination 2025-12-11(四) |
| 第 16 週 | Final Exam 2025-12-18(四) |
1. Semiconductor Material and Device Characterization, 3/e Author: Dieter K. Schroder 2. Handout Materials from Instructor
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