微電子積體電路製程
VLSI Manufacture Technology
| 節 | 週三 |
|---|---|
2 09:00–09:50 | 微電子積體電路製程 3 節連堂 |
3 10:10–11:00 | |
4 11:10–12:00 |
* 根據陽明交大上課時間表所列
This course provides a fundamental insight into the manufacturing technology of semiconductor devices and integrated circuits.
basics of fundamental physics, chemistry, and mathematics
無備註
Textbooks is downloadable via sources. Handouts will be given in the beginning of the semester.
Assignments and presentation: 30% Midterm exam (student presentations, + quiz) 30% Final exam (quiz + discussion of problems) 40% *All assignments and exams are carried out online.
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| 週次 | 主題 |
|---|---|
| 第 1 週 | Introduction 2026-02-25(三) |
| 第 2 週 | Semiconductor Basics 2026-03-04(三) |
| 第 3 週 | SOI Materials and Devices 2026-03-11(三) |
| 第 4 週 | Epitaxy and Substrates 2026-03-18(三) |
| 第 5 週 | Thermal Process 2026-03-25(三) |
| 第 6 週 | Photolithography: Photomask fabrication, photoresist 2026-04-01(三) |
| 第 7 週 | Plasma Basics-Physical Vapor Deposition 2026-04-08(三) |
| 第 8 週 | Midterm Exam. Student presentations 2026-04-15(三) |
| 第 9 週 | Dopand Diffusion, Etching 2026-04-22(三) |
| 第 10 週 | Integrated-Circuit Packaging 2026-04-29(三) |
| 第 11 週 | Chemical Vapor Deposition and Low-K Dielectrics 2026-05-06(三) |
| 第 12 週 | Atomic Layer Deposition 2026-05-13(三) |
| 第 13 週 | Electrical, Physical and Chemical Characterization 2026-05-20(三) |
| 第 14 週 | Failure Analysis 2026-05-27(三) |
| 第 15 週 | Integrated Circuit Processing Technologies 2026-06-03(三) |
| 第 16 週 | Final Exam 2026-06-10(三) |
| 第 17 週 | Reserved for discussions. 2026-06-17(三) |
1. Introduction to Semiconductor Manufacturing Technology (2nd Edition) (Xiao, Hong, SPIE, 2012) 2. Handbook of Semiconductor Manufacturing Technology,Robert Doering, Yoshio Nishi, (CRC press, 2008) 3. Semiconductor Devices Physics and Technology, S.M. Sze (2nd Edition) (John wiley & SONS, INC, 2002)
- 地點
- online
- 時間
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- 聯絡方式
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